※ Acid type copper plating additives GWCUADB001
1)Bath operating range wider, with excellent through-hole capacity.
2)Applicable to a high current density plating process.
3)Applicable to the high aspect ratio of the through-hole plating.
4)Enhance the effectiveness of the production capacity.
5)Good ductility.
6)Low internal stress.
7)Bath with long-term stable performance.

※ The alkaline strike copper additives GWCUSPA001, GWCUSPA002 、GWCUSPA003
1)Free of cyanide
2)Good coverage and adhesion.
3)Analysis management by titration
4)To use the same formulation formulated or as a replenishing solution.

※ Alkaline copper plating additives GWCUKAA001
1)Free of cyanide.
2)Good coverage.
3)Applicable to strike copper and thick copper plating.
4)Copper replacement reaction against iron material will not occur, forming a good adhesion between the iron base and copper plating layer.
5)It could also form a good adhesion against the material with low adhesion.
6)Analysis management by titration